The Union Cabinet chaired by the Prime Minister (PM) of India on August 12, 2025 approved four new semiconductor projects under the India Semiconductor Mission (ISM). These four proposals are from SiCSem, Continental Device India Private Limited (CDIL), 3D Glass Solutions Incorporated (3DGS) and Advanced System in Package (ASIP) Technologies.
Further, these four approved proposals will set up semiconductor manufacturing facilities with cumulative investment of around Rs 46 billion and are expected to generate a cumulative employment for 2,034 skilled professionals, which would catalyse the electronic manufacturing ecosystem resulting in creation of many indirect jobs. With these approvals, total approved projects under ISM reaches to 10 with cumulative investments of around Rs 1.60 trillion in 6 states.
Given the growing demand of semiconductors in telecom, automotive, data centres, consumer electronics and industrial electronics, these four new approved semiconductors projects would significantly contribute to making Atmanirbhar Bharat.
Furthermore, SiCSem and 3DGS will be set up in Odisha. CDIL is located in Punjab and ASIP will be set up in Andhra Pradesh.
SiCSem is collaborating with Clas-SiC Wafer Fab Limited, United Kingdom (UK), to establish an integrated facility of silicon carbide (SiC) based compound semiconductors in Info Valley, Odisha. This will be the first commercial compound fabrication facility in India. The project proposes to manufacture silicon carbide devices. This compound semiconductor fab will have an annual capacity of 0.06 million wafers and packaging capacity of 96 million units. The proposed products will have applications in missiles, defence equipment, electric vehicles (EVs), railway, fast chargers, data centre racks, consumer appliances, and solar power inverters.
Similarly, 3DGS will be setting up a vertically integrated advanced packaging and embedded glass substrate unit in Info Valley, Odisha. This unit will bring the World’s most advanced packaging technology to India. Advanced packaging brings the next generation of efficiency to the semiconductor industry. The facility will have a large variety of advanced technologies including glass interposers with passives and silicon bridges, and 3D heterogeneous integration (3DHI) modules. Planned capacity of this unit will be approximately 0.0696 million glass panel substrates, 50 million assembled units, and 0.0132 million 3DHI modules per annum. The proposed products will have significant applications in defence, high-performance computing, artificial intelligence (AI), radio frequency (RF) and automotive, photonics and co-packaged optics, etc.
Additionally, ASIP will set up a semiconductor manufacturing unit under a technology tie-up with APACT Company Limited, South Korea, with an annual capacity of 96 million units. The manufactured products will find applications in mobile phones, set-top boxes, automobile applications, and other electronic products.
Moreover, CDIL will expand its discrete semiconductor manufacturing facility at Mohali, Punjab. The proposed facility will manufacture high-power discrete semiconductor devices such as metal oxide semiconductor field effect transistor (MOSFET), insulated gate bipolar transistor (IGBT), schottky bypass diodes, and transistors, both in silicon and silicon carbide. The annual capacity of this brownfield expansion will be to the tune of 158.38 million units. The devices manufactured by these proposed units will have applications in automotive electronics including EVs and its charging infrastructure, renewable energy systems, power conversion applications, industrial applications, and communication infrastructure.
These projects would complement the growing chip design capabilities coming up in the country which are propelled by design infrastructure support provided by Government to 278 academic institutions and 72 start-ups.
