Digital Infrastructure Providers Association (DIPA) had the maiden participation at India Mobile Congress (IMC) 2023 inaugurated by Prime Minister Narendra Modi, organised by Department of Telecommunications (DoT).
One of the notable highlights of DIPA’s booth was the showcase of the latest innovations and technologies in the digital infrastructure sector. The digital infrastructure sector is rapidly evolving with various innovations and technologies emerging to enhance connectivity, data management, security, and sustainability. DIPA’s showcase also featured the critical role played by the infrastructure providers in the creation of digital public infrastructure (DPI) and ensuring telecom connectivity during the COVID-19 and natural disasters.
Commenting on the development, T. R. Dua, director general, DIPA, said, “In essence, infrastructure providers are the backbone of DPI, offering the essential tools, technologies, and services that enable governments, businesses, and individuals to operate in the digital world. Their role is pivotal in ensuring the effectiveness, security, and sustainability of digital public infrastructure, which in turn supports economic growth, innovation, and the well-being of society as a whole.”
Dua added, “DIPA congratulates Prime Minister Narendra Modi; Ashwini Vaishnaw, Union Minister of Communications, Electronics and Information Technology and Railways Minister; Neeraj Mittal, secretary, DoT, and DoT for successfully organising IMC. We look forward to participating at IMC in the coming years.”