Bosch Global Software Technologies (Bosch) and Chennai-based fabless semiconductor startup Mindgrove Technologies have reportedly signed a memorandum of understanding (MoU) to jointly develop and deploy high-performance system-on-chip (SoC) solutions. These will be targeted at applications across automotive, consumer electronics, industrial automation, and internet of things (IoT) infrastructure.
Under the partnership with Bosch, Mindgrove will design SoCs for both local and global markets. Bosch will contribute its expertise in research and development (R&D), embedded software development, and verification support. The chips will be based on the open-standard Reduced Instruction Set Computing, version 5 (RISC-V) instruction set architecture.
As part of the collaboration, Mindgrove will supply Bosch with chips and boards for field deployment and testing, along with engineering and logistics support. The data gathered from these deployments will be used for further improvements. Bosch will provide controlled access to elements of its ToolBundle platform and co-develop new applications with Mindgrove using these SoCs, while also framing a go-to-market strategy.
Further, to facilitate validation and testing, Bosch will initiate field deployments of the SoCs, positioning the solution for broader third-party adoption.
