Tata Electronics’ semiconductor unit in Assam has commenced the construction of its plant. The unit will be set up with an investment of Rs 270 billion and is expected to generate 15 thousand direct and 11-13 thousand indirect jobs. The proposed capacity of this unit is 48.3 million semiconductor chips per day.
In addition, the unit will be the site for development of indigenous advanced semiconductor packaging technologies including Wire Bond, flip chip and integrated system in package technologies (I-SIP) and all these three major technologies which will be deployed in this plant are being developed in India. These technologies are extremely critical for key applications such as automotive (especially electric vehicles), communications, network infrastructure and others.
