The prime minister of India has been presented with first set of Made-in-India chips by the union minister of electronics and information technology. Launched in December 2021, the India Semiconductor Mission has achieved the transition from approvals to production in just three and a half years, a feat described by the union minister as a moment of pride thanking the prime minister for his farsighted vision, strong will and decisive action. The minister also said that, from 7.8 per cent gross domestic product (GDP) growth to a growing semiconductor ecosystem with first ‘Made in India’ chips, Bharat stands as a lighthouse of stability.

The minister emphasised that India’s Semiconductor Mission is built on trust respecting intellectual property rights, supporting supply chain development, and promoting co-development models with global partners. “India has always gone to the world as a partner, fostering mutual growth and win-win collaborations,” he said, adding that this trusted position is one of India’s strongest advantages in the global value chain.

12 memorandums of understanding (MoUs) were announced during Semicon India 2025. These agreements focus on enhancing product development, expanding service capabilities, and strengthening the skill development sector, with the aim of building a self-reliant and future-ready semiconductor ecosystem in the country.

To further strengthen innovation, the minister announced the formation of the Deep Tech Alliance, with close to a billion dollars already committed. Initially focusing on semiconductors, the alliance will expand to other frontier sectors such as clean energy, biotechnology, quantum technologies, and space. The minister said this would provide much-needed venture capital support for emerging deep tech industries.

Further, the minister stated that the Semiconductor Laboratory, Mohali modernisation programme is progressing well, aimed at increasing production levels, enabling new product tape-outs, and strengthening India’s high-value, mid-volume manufacturing capacity. Building on the success of ISM 1.0, the government is also preparing to launch ISM 2.0, which will broaden support for fabs, outsourced semiconductor assembly and test (OSAT) units, capital equipment, and materials to cover the entire semiconductor value chain.

The minister stated that exports will be an integral part of the ten approved projects, ensuring that chips made in India will serve both domestic and global markets. Independent studies indicate that semiconductor production in India is already 15-30 per cent more cost-competitive compared to global benchmarks. He further underlined that India never rushed through project approvals but ensured professional assessment for sustainable progress. With two fabs already in place and more in the pipeline, India is building momentum in an industry where, once the foundation is set, growth accelerates exponentially.

MOUs / Announcements at SEMICON India 2025:

  • MoU between Tata Electronics and Merck to strengthen semiconductor capabilities in India in the area of manufacturing and packaging
  • MoU between Tata Electronics and Centre for Development of Advanced Computing (C-DAC) to develop domestic semiconductor design and internet protocol (IP) ecosystem
  • Announcement to kickoff joint development of India’s first fully localised automative camera module, launched by Kaynes Semicon in collaboration with SPARSH-IQ. 3rdiTech, Focally and SenseSemi Technologies
  • Announcement to deliver India’s first mobile email management (MEMs) microphone and advanced semiconductor packages by Kaynes Semicon in collaboration with Infineon
  • Announcement to kickoff for joint development for Make-in-India Secure Chip, embedded with Smart Operating System, designed to power the next generation of digital identity solution – such as electronic passports – built on a scalable security architecture by L&T Semiconductor in collaboration with IIT Gandhinagar and C-DAC
  • MoU between L&T Semiconductor and IISc Bangalore to build a national innovation hub for semiconductor research and quantum leadership
  • Unveiling of India’s first internet of thing (IoT) Evolution Board integrating the indigenous VEGA processor by C-DAC with Bluetooth and LoRa connectivity by Indiesemic – A woman co-led domestic startup at Gujarat
  • MoU between NIELIT and Singapore Semiconductor Industry Association (SSIA) to promote semiconductor skilling, industry academia linkages, and capacity building in semiconductor technologies
  • MoU between ISM and New Age Makers Institute of Technology (NAMTECH) to establish a collaborating framework to build a future-ready talent pipeline for India’s rapidly growing semiconductor ecosystem, while advancing applied research and innovation in line with ISM’s national roadmap
  • MoU between the Arizona State University and India Semiconductor Mission (ISM) on scientific and educational collaboration
  • MoU among C-DAC, Synopsys, and IIT Madras Pravartak to provide flexible access of Synopsys IPs to approved companies under the design linked incentive (DLI) scheme

Announcement on availability of design infrastructure support to approved companies under the DLI scheme which includes the following:

IP core from:

  • ITC Korea
  • Secure IC
  • Cadence Design Systems
  • Analogue Bits

EDA tools from:

  • Sim Yog Technologies
  • Cadre design systems

Post silicon validation services from:

  • Emerson Global
  • Smartsoc Solutions
  • Cyient Semiconductor