The prime minister of India has laid the foundation stone of India Chip Private Limited’s outsourced semiconductor assembly and test (OSAT) facility in the Yamuna Expressway Industrial Development Authority (YEIDA) area in Jewar, Greater Noida.
India Chip is a 60:40 joint venture between HCL Group and Taiwan based Foxconn. The facility is being established with an investment of Rs 37 billion and is expected to become operational by 2028.
Further, the project will position India Chip among a limited number of domestic companies to begin display driver chip production within the country. The facility is projected to generate more than 3,500 direct and indirect jobs, support the development of local supply chains and attract partners across the semiconductor value chain.
With a planned capacity to process 20,000 wafers per month, the plant is expected to help meet India’s rising domestic demand for semiconductor components and strengthen a resilient and self-reliant semiconductor supply chain.
