India’s first commercially packaged multi-chip module (MCM) has been rolled out from Kaynes Semicon’s outsourced semiconductor assembly and test (OSAT) facility in Sanand and delivered to California-based Alpha & Omega Semiconductor (AOS). As part of the first shipment, around 900 intelligent power modules (IPMs) were supplied to AOS.
IPMs are semiconductor devices that integrate power switching components such as insulated gate bipolar transistors (IGBTs) with their respective drive and protection circuits into a single, compact package, simplifying motor control and other power applications.
Unlike single-die packages that contain all components on one silicon die, multi-die packaging combines multiple smaller dies, or “chiplets,” within one package. This approach enables designers to integrate diverse technologies and processes, resulting in higher yields, faster production, greater modularity, and more powerful, customised solutions. These IPMs are designed for high-power and critical applications, including electric vehicles (EVs) and renewable energy systems, where reliability and safety are paramount.
