The Indian government is planning to broaden its initiative for establishing semiconductor chip fabrication and packaging facilities, along with other companies within the ecosystem, as part of the second phase of the India Semiconductor Mission (ISM).
Additionally, the government is concentrating on attracting other companies, including raw material suppliers, gas companies, and various vendors related to the semiconductor ecosystem, while also working to bring in chip fabrication and packaging units. According to ISM’s chief executive officer, Akash Tripathi, there are about 20 proposals in the pipeline from these players.
For instance,a proposal from Tower Semiconductor to establish a chip fabrication unit is currently under review by the ISM, and the central government has requested further details from the company. However, a formal proposal from the Tower Semiconductor-Adani Group joint venture has yet to be submitted to the ISM.
Recently, a Maharashtra cabinet panel approved a $ 10 billion investment proposal from the Tower Semiconductor-Adani Group joint venture to set up a semiconductor chip manufacturing unit in Taloja, Panvel. This proposed facility, located in the Navi Mumbai suburbs of Raigad district, will initially have a capacity of 40,000 wafer starts per month (WSPM), with plans to expand to 80,000 WSPM in the future.
