HFCL Limited has collaborated with MediaTek to integrate its chipset with the company’s indoor 5G solution to help telecom operators address last-mile connectivity challenges.
With the help of the MediaTek T750 chipset, HFCL’s 5G FWA Indoor CPE now has features like an ultra-compact form factor and minimal power consumption, which are intended to push the government’s goal of developing a sustainable telecom environment.
The HFCL 5G solution has an embedded eSIM that features a 2.5 Gbps ethernet interface for high-speed data transfer. According to HFCL, it is a plug-and-play device that includes an AI-integrated mobile app, enabling user-friendly self-installation and helping identify the best signal location.
