HCLTech and Suchi Semicon have entered a partnership to combine HCLTech’s semiconductor design and digital engineering capabilities with Suchi Semicon’s outsourced semiconductor assembly and test (OSAT) manufacturing operations in Gujarat. The two companies aim to provide an integrated design to backend solution for both global and domestic chip customers.
Unlike HCLTech’s separate joint venture with Foxconn for display semiconductor manufacturing, this collaboration does not involve any equity participation or a joint manufacturing entity. Both companies will operate independently while jointly approaching customers.
HCLTech will leverage its established relationships with global fabless semiconductor companies and integrated device manufacturers to generate backend manufacturing opportunities for Suchi’s OSAT facility. The partnership will focus on product categories different from HCLTech’s display oriented venture with Foxconn.
Suchi Semicon, headquartered in Surat, is moving beyond the pilot and beta stages at its OSAT facility. Over the past year, it has supplied initial batches to its United States based anchor customer, as well as to clients in Europe and Asia. At present, all production is export oriented. The pilot line, with a capacity of about 130,000 units per day, is fully committed to the anchor client. Commercial production is expected to begin in financial year 2026-27, with a long-term capacity target of three million units per day by 2029-30.
The partnership with HCLTech is expected to add double digit million units annually once customer approvals and capacity expansions are completed. While financial details were not disclosed, the companies described the arrangement as a long-term collaboration with clearly defined volume targets over the next three years.