The government of Odisha has signed three memoranda of understanding (MoU) with India Electronic and Semiconductor Association (IESA), Synopsys, and Electronics and Computer Software Export Promotion Council (ESC), to build an ecosystem for the manufacturing of semiconductors.

The agreement with IESA will enable the Odisha government to develop capacity-building programs and foster the semiconductor ecosystem through events and the conceptualisation of knowledge materials.

Further, the MoU with Synopsys will entail collaboration in areas such as the Odisha Chip (O-Chip) program, talent transformation, workforce development, readiness evaluation of the state in semiconductors and very-large-scale integration (VLSI) domains, and internship and job placement assistance to students of Odisha engineering institutions. Additionally, the MoU with ESC will promote the export of electronics and information technology and information technology-enabled services (IT/ITeS) from the country.

Additionally, the Odisha government hosted Odisha4Silicon 2023, which featured the launch of the pan-Indian Design Challenge under the O-Chip program, organised by Electropreneur Park, Bhubaneswar, Odisha. The event also saw the launch of the IESA Odisha Chapter, and the Campus Connect Program, which aims to foster innovation, skill development, and industry-academia collaboration in the state. The state also launched the Odisha Semiconductor Fab and Fabless Innovation and Acceleration Program.