The Continental Device India Semiconductors (CDIL) has announced that it will add new semiconductor packaging lines through the government’s Scheme for Promotion of Manufacturing of Electronic Components and Semiconductors (SPECS), while aiming towards bolstering annual capacity by 100 million with these new lines.

CDIL has already begun the first phase of this production with a surface-mount packaging line of 50 million devices that will be inaugurated by the Minister of State for Electronics and IT, Rajeev Chandrasekhar on September 28, 2023.