The government has received proposals from five companies to set up electronic chip and display manufacturing plants with investment of $20.5 billion (Rs 1.53 trillion).

Three companies viz., Vedanta in joint venture (JV) with Foxconn; IGSS ventures pte, and Singapore; ISMC, have submitted applications for semiconductor fabs. The applications have been received for setting up 28 nm to 65nm semiconductor fabs with capacity of approximately 120,000 wafers per month and the projected investment of $13.6 billion wherein fiscal support from the central government is being sought for nearly $5.6 billion.

Under the scheme for setting up of display fabs in India, applications have been filed for setting up Gen 8.6 TFT LCD Display Fab as well as 6th generation display fab for the manufacture of state-of-art AMOLED display panels that are used in the advanced smartphones.

Two companies viz., Vedanta and Elest have submitted applications for display fabs with the projected investment of $6.7 billion wherein fiscal support from the Central Government is being sought for nearly $2.7 billion.

The applicant companies under the semiconductor and display fab schemes have been issued acknowledgment by India Semiconductor Mission (ISM) that has been set up as an independent institution to spearhead the Semicon India programme. ISM will coordinate with the applicant companies who have also reached out to states to provide access to world class infrastructure. It will work closely with the state governments to establish high-tech clusters with 300 – 500 acres of developed land, 100 KVA power, 50 MLD water, availability of natural gases and common facility centres for testing and certification.

In addition, the Design Linked Incentive (DLI) scheme has been successful in generating interest among domestic companies and startups with applications registered on the India Semiconductor Mission portal. Three companies viz., Terminus Circuits, Trispace Technologies and Curie Microelectronics have submitted applications under this scheme.

The applicant companies have also submitted the proposals for technology acquisition, partnerships and collaborations with research institutes as part of the applications.