Indonesian telecom operator PT Telekomunikasi Indonesia (Telkom) plans to issue up to $326 million worth of bonds on June 28-29, 2010. Part of the proceeds will be used for its capex for 2010-11. Telkom has selected Bahana Securities, Danareksa Sekuritas and Mandiri Sekuritas to act as the lead underwriters of the bond sale, which will be issued in two tranches - one with a five-year maturity period and the other with a maturity period of over 10 years. The operator is yet to decide on the exact size and coupon value of each tranche.
