India’s Electronics System Design and Manufacturing ecosystem (ESDM) is experiencing significant growth in semiconductor and electronics products, manufacturing, and design services. The nineteenth India Electronics and Semiconductor Association (IESA) Vision Summit and Gujarat Semiconnect in Gandhinagar showcased the “Vision to Reality” journey, highlighting key milestones shaping India’s semiconductor and electronics landscape, co-organised by Semiconductor Equipment and Materials International (SEMI) and inaugurated by Bhupendrabhai Patel, chief minister, Gujarat.

Key highlight of the summit was the launch of five most innovative products under the “Vision to Reality: Make in India Milestones” theme:

  • Launch of a unique semiconductor test tool and new facility by Tessolve in Bangalore.
  • Launch of Sapphire Ingot by Polymatech.
  • Launch of India’s first small outline integrated chip (SOIC) 16L chip assembled/packaged by Suchi Semicon.
  • Launch of quad flat no-lead package (QFN) packaged power device by RRP Electronics.
  • Launch of Beamformer IC by Fermionics.

In addition, the Vision Summit showcased a remarkable display of innovation, featuring more than 100 esteemed exhibitors and 250 booths under the theme ‘Sand to Silicon to Systems’. The event witnessed enthusiastic participation from ecosystem partners worldwide, with all anchor units that have announced semiconductor manufacturing projects in India proudly showcasing their capabilities and future plans. The exhibition served as a pivotal platform for industry leaders, start-ups, and academia to present cutting-edge products and solutions, driving collaboration and technological advancements. It played a crucial role in highlighting India’s growing self-reliance in semiconductor and electronics manufacturing, reinforcing its position as a global innovation hub. All 2,500 conference delegates and over 1,000 students gained valuable insights into India’s rapidly advancing semiconductor and electronics landscape, witnessing its capabilities, progress, and vision for the future

Commenting on the event, Ashok Chandak, president, IESA, said, “As we celebrate the outstanding accomplishments of today, these product launches and ‘Sand to Silicon to Systems exhibition’ also spark the ideas that will shape tomorrow’s innovations, inspiring a new wave of breakthroughs in country’s ESDM sector and accelerate our journey in this strategic sector.”

Meanwhile, Dr Veerappan, chairperson, IESA, highlighted that these critical launches demonstrate the country’s growing potential to design, develop, and manufacture innovative semiconductor and electronic products and are a significant step towards achieving the central government’s vision of driving advanced design and innovations led manufacturing.