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July 15, 2010

Qualcomm introduces dual-CPU Snapdragon chipsets
US-based Qualcomm has delivered its first dual-CPU (central processing unit) Snapdragon chipsets. The mobile station modem (MSM) solutions, MSM8260 and MSM8660, integrate two of the company's enhanced cores running up to 1.2 GHz.Targeted at enabling high-end smartphones, these MSM8x60 solutions are third-generation chipsets from the company's Snapdragon platform that has been powering smartphones, tablets and smartbook devices.

The enhanced cores provide high levels of web application and multimedia performance, including a powerful graphics processing unit with 3D/2D acceleration engines for Open GLES 2.0 and Open VG 1.1 acceleration, 1080p video encode/decode; dedicated low power audio engine; integrated low power GPS; and support for 24-bit WXGA 1280x800 resolution displays.

Qualcomm's Snapdragon family of chipset solutions includes first-generation products (QSD8x50 with 1 GHz enhanced core), second-generation products (MSM8x55 and QSD8x50A with 1 GHz enhanced core including multimedia optimisation and 1.3 GHz enhanced core respectively) and third-generation products (MSM8260 and MSM8660, and QSD8672 with dual-CPU architecture featuring enhanced cores running at up to 1.2 GHz and 1.5 GHz respectively).

RAD Data launches pseudowire access gateway
RAD Data Communications has launched IPmux-155L, an entrylevel hub-site pseudowire access gateway. This cost-competitive access aggregator, which delivers TDM pseudowires and uses fast Ethernet traffic over packet switched networks, guarantees minimal processing delays due to its enhanced performance.

The device functions as a pseudowire termination unit, sending TDM bundles from remote units to SDH backbones while directing Ethernet traffic to packet networks. Featuring standard SAToP capabilities, the IPmux-155L allows enterprises to replace leased lines with cost-effective packet transport and offers an ideal solution for economical PSTN access and PBX backhaul.

The IPmux-155L supports separate configurations for up to 63 pseudowire connections. Configurable packet size balances packet switched network throughput and delay, while a jitter buffer compensates for packet delay variation of up to 200 milliseconds in the network. The IPmux-155L's Ethernet attributes include port-based VLAN membership and VLAN tagging as well as VLAN stacking. It also supports port-based rate limitation per granular committed information rate and committed burst size, enabling the total transmitted bandwidth to be adapted to the limitations of the transport media.

Clocking options such as loopback timing, external clock source or internal clock (using the device's own oscillator) ensure synchronisation. In addition, IPmux-155L can also recover original clock, using adaptive clock recovery (ACR) in addition to offering clock capabilities including holdover and hitless switching.

Tektronix and SenarioTek introduce wideband microwave frequency conversion
Tektronix, along with SenarioTek, a leading provider of custom RF/microwave test and measurement solutions, has launched a customisable standard solution for wideband microwave frequency up/down conversion. This solution enables calibrated wideband radar and satellite signal generation for analysis and testing requirements greater than 1 GHz bandwidth, and for carrier frequencies up to 50 GHz on standard Tektronix instruments.

Wideband radar and wideband satellite communications signals use carrier frequencies that are beyond the direct synthesis and analysis capabilities of wideband RF instruments. In order to test radar and satellite devices using these instruments, engineers build their own test fixtures and signal conditioning capabilities.
However, the use of this new SenarioTek solution will enable engineers to take advantage of a calibrated and optimised solution for testing by using Tektronix RF test instruments such as the AWG7000 series signal generators and the DPO/DSA/ MSO70000 series high-performance oscilloscopes.

The SenarioTek solution improves microwave test performance by matching microwave up and down conversion from, and to, an intermediate frequency. This optimises the performance of Tektronix instruments and eliminates instabilities, costs and periodic calibration of in-phase quadrature modulator conversion techniques. It also provides the widest bandwidth signal generation that can be used for both multi-band radar and satellite communication frequencies.

Aricent and NetLogic Microsystems collaborate to offer LTE eNodeB solutions
Aricent and NetLogic Microsystems have collaborated to offer advanced long term evolution (LTE) capabilities on NetLogic Microsystems' XLS family of MIPS64based multi-core, multi-threaded processors. The two companies have together created a pre-optimised, fully integrated platform on which telecom equipment manufacturers can develop advanced LTE eNodeB platforms.

Aricent's LTE solutions offer equipment manufacturers end-to-end solutions including pre-packaged software frameworks conforming to the latest 3GPP standards, along with a comprehensive set of product life-cycle services to develop feature-rich and differentiated products while gaining significant time-to-market advantage at lower research and development costs. Aricent's portfolio of services spans the entire product life cycle from strategy and design to requirement definitions and software development to interoperability, testing and certification. These pre-packaged software and services have significantly reduced the costs associated with bringing capital-intensive LTE products to the market. The offerings include:

  •   LTE user equipment software suite -­ a complete software package for device and semiconductor vendors including fully optimised Layer 1, Layer 2 protocol software with support for 100 Mbps downlink and 50 Mbps uplink data rates. Its implementation ensures optimal power consumption, processor utilisation and easy integration on multiple hardware platforms.
  •  eNodeB protocol stacks and framework -­ this provides a turnkey solution for radio access, from pluggable stack software to pre-integrated and optimised software frameworks for radio access equipment. It also serves as a robust software platform for infrastructure providers planning to develop a complete LTE release 8+ compliant eNodeB of varying densities.
  •  IP backhaul solution -­ this is based on the ISS metro platform which offers pre-integrated Layer 2 switching solutions and can be used to build LTE and IP backhaul devices such as IP RAN aggregation devices, internet offload gateways and metro Ethernet devices.
  •  Evolved packet core protocol stacks and framework, frameworks for the system architecture evolution gateway and the mobility management entity gateway -­ these include support for charging, quality of service, high availability, lawful interception and bearer-related features.

ON Semiconductor launches IPD2 process technology
ON Semiconductor, a leading supplier of energy-efficient silicon solutions, has introduced a new integrated passive device (IPD) process technology. An enhancement of the company's existing HighQ copper (Cu) on silicon (Si) IPD technology, the new IPD2 process features a second 5 um copper layer that increases inductor performance, allows greater flexibility and supports the design of cost-effective IPDs for RF system in package applications in portable electronics equipment.

The HighQ IPD2 process utilises advanced 8-inch wafer technology. Typical design aspects include a balun transformer, low pass filters, band pass filters and diplexers used in portable and wireless applications. These IPD2-based designs provide benefits for circuit designers including reduced cost, reduced thickness, small footprint and higher performance that equates to longer battery life.

ON Semiconductor offers fully featured design tools and design support in addition to rapid prototyping capabilities for its IPD2 process technology. This enables potential users to cost effectively assess whether their integrated PCB solutions, more costly ceramic solutions, or more expensive Gold (Au) on Gallium Arsenide (GaAs)-based IPDs are suitable for conversion.

Microchip introduces a range of low power 8-bit microcontrollers
Microchip Technology, a provider of microcontroller, analog and Flash-IP solutions, has launched the PIC18F "K90" and the PIC18F "K22" families of 8-bit microcontrollers, the latest MCUs based on its low power technology, nanoWatt XLP. The K90 represents the industry's first ultra low power MCU family to include an on-chip LCD driver module capable of driving LCDs up to 192 pixels. Both families support 1.8 to 5.5V operation, offer a 12-bit analog-to-digital converter (ADC), and Microchip's mTouch capacitive touch-sensing technology, along with other peripheral configurations.

The PIC18F K90 family represents an expansion to Microchip's high-end 8-bit LCD microcontroller offerings and is ideal for driving large segmented LCDs while consuming low power. The family is available in 64and 80-pin packages with 32 kB to 128 kB of Flash memory, and up to 4 kB of RAM and 1 kB of on-chip EEPROM.

The PIC18F K22 MCUs provide features such as operation from 1.8 to 5.5V, numerous communication channels, 8 to 128 kB Flash memory, and peripherals for mTouch capacitive touch-sensing applications. Other features include a 12-bit ADC, multiple PWMs and additional timers.

Both the K90 and K22 families are suitable for use in home automation, appliance and industrial applications, as well as the medical and automotive markets. The K22 family is offered in 20to 80-pin packages with 8to 128-kbyte of program memory. The K90 family is available in 64to 80-pin packages and between 32and 128 kbyte program memory. These new MCUs feature nanoWatt XLP technology for extremely low power operation, with sleep currents down to 20 nA. In addition, the MCUs provide more than 50 per cent improvement in active current compared to previous generations.

Plug-in modules (PIMs) for the PIC18LF45K22 (part No MA160014) and PIC18F87K22 (part No MA180028) MCUs are also new. The PIMs can be used with the PIC18 explorer board (part No DM183032). A PIM for the PIC18F87K90 MCU has also been launched (part No MA180027). This can be used with the PICDEM LCD 2 demo board (part No DM163030), or stand-alone in a custom application.

Roamware offers roaming intelligence system
Roamware provides operators with a suite of network analytical services that enable insight into their roaming market opportunities on the inbound and outbound roaming revenue streams.

The company's new roaming intelligence system solution gathers comprehensive data on inbound market share, enabling companies to measure their market share of inbound roaming from their respective roaming partners and utilise this intelligence in negotiating preferred roaming relationships and interoperator tariffs. The new system also allows operators to identify a number of coverage issues in their own network resulting in loss of roamers, enabling them to proactively address coverage gaps and plug revenue leakage.

In addition, the intelligence system provides actionable insight on traffic steering initiatives of their roaming partners, competing networks in their own territory and the effectiveness of their own steering tool in directing roaming customers on to preferred networks.



 
 

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